Analytical Services

Established in 2004, ACE specialists have the highest level of expertise in the industry performing FIB services on thousands of front side and flip chip packages with extremely high success rates.


FIB Circuit Edit

  • Execute circuit edits on wire bond packages, flip chips, dies and wafer
  • Create probe points
  • Perform full thickness Silicon edits on flip chips
    (NO SAMPLE PREPARATION REQUIRED)
  • Edit traces of Copper, Aluminum, Tungsten and Gold
  • Achieve successful 22 nm edits
C U Etch

Dual Beam FIB

  • Perform cross sections of varied samples
  • Prepare TEM samples
  • Obtain EDX data

SAME DAY, EVENING and WEEKEND coverage at no extra charge